Patented is a thermal interface material with stretch release properties comprising a blend of polymeric hot melt pressure sensitive adhesive. It has a number average molecular weight of greater than 25,000 and at least 40% by weight of thermally conductive filler based on the total weight of the composition. The material also has substantially continuous, individual viscoelastic microfibers and/or elastic microfibers with a maximum diameter of from about 0.05 to about 5 micrometers dispersed through the adhesive matrix and oriented in the machine direction, wherein the material contains less than about 5 void volume percent.